Laser Cleaning by Feng Song & Xuechun Lin

Author:Feng Song & Xuechun Lin
Language: eng
Format: epub
ISBN: 9789819766314
Publisher: Springer Nature Singapore

The laser pulse width affects the thermal diffusion length and action time of the material, thereby affecting the removal effect. Dobler et al. used a frequency-doubled (λ = 532 nm) Q-switched Nd:YAG laser to clean silicon wafers, with a laser pulse width of 10–20 ns. The study found that the acceleration of particles does not change as strongly with pulse width as expected from a standard Gaussian beam, suggesting that the pulse shape is not an ideal Gaussian beam. However, it can be determined that the shorter the pulse width, the greater the acceleration obtained by the particles, and the easier the particles are removed. The fitting curve shows that the maximum acceleration that particles can obtain is inversely proportional to the square of the pulse width. At the same time, if the pulse width is too short, energy accumulates on the surface, which can easily cause substrate damage [19].IV.

Pulse Number

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