RF and Microwave Microelectronics Packaging by Ken Kuang Franklin Kim & Sean S. Cahill
Author:Ken Kuang, Franklin Kim & Sean S. Cahill
Language: eng
Format: epub
Publisher: Springer US, Boston, MA
References
1.
IPC 4101 B- Specification for base materials for rigid and multilayer boards
2.
Microvias for low cost, high density interconnects – John H. Lau, S.W. Ricky Lee-ISBN-0-07-136327-0
3.
Printed circuits handbook – Clyde f. Coombs Jr. 4th Edition-ISBN-0-07-012754-9
4.
Advanced ALIVH substrate with fine design rules for high density packaging. Ishimaru, Yukihiro et al. 1999
5.
New B2it method for highdensity printed circuit boards. Circuit Mounting Society Journal, 1998
6.
IPC 9701A- Performance test methods and qualification requirements for surface mount solder attachments
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