Oxide Thin Film Transistors by unknow

Author:unknow
Language: eng
Format: epub, pdf
ISBN: 9781394200252
Published: 2024-10-30T00:00:00+00:00

4.4.1.1 Fabrication of Polyimide Substrate

Flexible substrates could be prepared by a laminating or coating method on a glass carrier, followed by fabricating TFT array and display devices. The PI substrate can be manufactured using a polymeric solution process on carrier glass and then, de-bonding it after display fabrication. Note that the concerns of the laminating type of substrate technology are (i) the difference in thermal expansion coefficients between plastic and glass and (ii) thermal damage of adhesive glue on the carrier glass. Currently, the popular flexible AMOLED is made by the PI coating process. The amber color PI varnish can be spin- or slit-coated on the carrier glass. The slit-coating method has been applied to G6.5 carrier glass for flexible AMOLED manufacturing. The process temperature can be 450–500 °C because the CTE of the PI is not much different from that of the carrier glass, i.e., is 4–7 ppm/°C vs. 3 ppm/°C. The manufacturing steps are glass cleaning, slit-coating of PI varnish, PI curing in a furnace chamber, and PECVD deposition of the gas barrier layer.

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