Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering by Seonho Seok

Author:Seonho Seok
Language: eng
Format: epub, pdf
Publisher: Springer International Publishing, Cham

Fig. 3.30PerMX stress simulation results; a substrate deformation, b residual stress distribution, c deflection at wafer center

Fig. 3.313D FEM model of PerMX cap package

Fig. 3.32Simulation results of PerMX cap package; a deformation in z-direction, b stress distribution

Fig. 3.33Simulation and measurement of PerMX cap deflection as a function of sealing ring width for different cap size

3.3.4 BCB Polymer Cap Modeling

BCB film stress has been estimated 36.8 MPa by measuring curvature of a bare Si wafer coated with the film as described in previous section. For the purpose of film stress characterization, load-deflection method can be also utilized. The load-deflection method has been frequently used for the measurement of the mechanical properties of thin film [17, 18]. The deflection of a suspended film, as shown in Fig. 3.34, is measured as a function of applied pressure and its behaviour has a form of equation given below.

Fig. 3.34Concept of load-deflection characterization of a film

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