ABCs of Electronics by Farzin Asadi
Author:Farzin Asadi
Language: eng
Format: epub
ISBN: 9798868801341
Publisher: Apress
Placing the ICs on the Breadboard
Different ICs have different packages. Some of the most famous packages are dual-in-line package (DIP), surface-mount device (SMD), small-outline IC (SOIC), small-outline package (SOP), quad-flat package (QFP), quad-flat no-leads (QFN), small-outline transistor (SOT), and ball-grid array (BGA). These packages are shown in Figure 6-9.
Figure 6-9Different IC packages
Only ICs with DIP package can be connected to a breadboard. Figures 6-10 and 6-11 show the correct and wrong methods of connecting a DIP IC to a breadboard, respectively.
Figure 6-10Correct method of connecting a DIP IC to a breadboard
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